8Layers, FR4 Tg175 Shengyi (S1165M)

 

8Layers, FR4 Tg175 Shengyi (S1165M)

Material: S1165M Shengyi
Surface Finishement:
ENIG 2U
Soldermask: Green
Minimum Via Holes: 4mil
Minimum Track width or Space Between Tracks: 4mil
Total Thickness: 2mm

*Special Requirements:

  •  Via in Pad,
  •  Copper Weight: Inner 0.5oz/Outer 1oz