8Layers, FR4 Tg175 Shengyi (S1165M)

  8Layers, FR4 Tg175 Shengyi (S1165M) Material: S1165M Shengyi Surface Finishement: ENIG 2U Soldermask: Green Minimum Via Holes: 4mil Minimum Track width or Space Between Tracks: 4mil Total Thickness: 2mm *Special Requirements:  Via in Pad,  Copper Weight: Inner 0.5oz/Outer 1oz