8Layers, FR4 Tg180 ITEQ (IT-180A)

 

 

8Layers, FR4 Tg180 ITEQ (IT-180A)

Material: IT-180A ITEQ
Surface Finishement:
ENIG 2U
Soldermask: Blue Matt
Minimum Via Holes: 3mil
Minimum Track width or Space Between Tracks: 3mil
Total Thickness: 1.6mm

*Special Requirements:

  • Blined and Burried Vias (L1-L2, L1-L3, L6-L8, L7-L8)
  • Impedance Controlled
  • Via in Pad
  • Copper Weight: inner 1oz/outer 1oz