8Layers, FR4 Tg180 ITEQ (IT-180A)

    8Layers, FR4 Tg180 ITEQ (IT-180A) Material: IT-180A ITEQ Surface Finishement: ENIG 2U Soldermask: Blue Matt Minimum Via Holes: 3mil Minimum Track width or Space Between Tracks: 3mil Total Thickness: 1.6mm *Special Requirements: Blined and Burried Vias (L1-L2, L1-L3, L6-L8, L7-L8) Impedance Controlled Via in Pad Copper Weight: inner 1oz/outer 1oz