8Layers, FR4 Tg185 Shengyi (S1000-2)

 

 

8Layers, FR4 Tg185 Shengyi (S1000-2)

Material: S1000-2 Shengyi
Surface Finishement:
ENIG 2-3U
Soldermask: Green Matt
Minimum Via Holes: 3mil
Minimum Track width or Space Between Tracks: 3mil
Total Thickness: 1.6mm

*Special Requirements:

  •  Blined and Burried Vias (L1-L2, L1-L3, L5-L8, L6-L8),
  •  Impedance Controlled,
  •  Via in Pad,
  •  Copper Weight: inner 1oz/outer 1oz