8Layers, FR4 Tg185 Shengyi (S1000-2)

    8Layers, FR4 Tg185 Shengyi (S1000-2) Material: S1000-2 Shengyi Surface Finishement: ENIG 2-3U Soldermask: Green Matt Minimum Via Holes: 3mil Minimum Track width or Space Between Tracks: 3mil Total Thickness: 1.6mm *Special Requirements:  Blined and Burried Vias (L1-L2, L1-L3, L5-L8, L6-L8),  Impedance Controlled,  Via in Pad,  Copper Weight: inner 1oz/outer 1oz