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14Layers, FR4 Tg180
Material: FR4 Tg180
Surface Finishement: ENIG 2-3U
Soldermask: Green Matt
Minimum Via Holes: 3mil
Minimum Track width or Space Between Tracks: 3mil
Total Thickness: 2.4mm
*Special Requirements:
- Blined and Burried Vias,
- Impedance Controlled,
- Via in Pad,
- Copper Weight: inner 1oz/outer 1oz