 |
 |
 |
|
8Layers, FR4 Tg175
Material: FR4 Tg175
Surface Finishement: ENIG 2U
Soldermask: Green
Minimum Via Holes: 4mil
Minimum Track width or Space Between Tracks: 4mil
Total Thickness: 2mm
*Special Requirements:
- Via in Pad,
- Copper Weight: Inner 0.5oz/Outer 1oz