8Layers, FR4 Tg180

Material: FR4 Tg180
Surface Finishement: ENIG 2U
Soldermask: Blue Matt
Minimum Via Holes: 3mil
Minimum Track width or Space Between Tracks: 3mil
Total Thickness: 1.6mm

*Special Requirements:

Blined and Burried Vias (L1-L2, L1-L3, L6-L8, L7-L8)
Impedance Controlled
Via in Pad
Copper Weight: inner 1oz/outer 1oz