8Layers, FR4 Tg185

Material: FR4 Tg185
Surface Finishement: ENIG 2-3U
Soldermask: Green Matt
Minimum Via Holes: 3mil
Minimum Track width or Space Between Tracks: 3mil
Total Thickness: 1.6mm

*Special Requirements:

Blined and Burried Vias (L1-L2, L1-L3, L5-L8, L6-L8),
Impedance Controlled,
Via in Pad,
Copper Weight: inner 1oz/outer 1oz